Staff Thermal Analysis Engineer

Job Overview

Arm has an exciting opportunity for a Staff Thermal Analysis Engineer in our System-in-Package Integration team. You will work closely with IP, SoC Design and Systems teams throughout the company. As we develop new system-level solutions for our world-class Arm IP ecosystems, thermal considerations are becoming more prevalent, and require a passionate engineering focus to prepare Arm and our partners for how to best address these challenges. This opportunity will focus on understanding the thermal environment and objective, providing solutions and guidance for mitigating the thermal challenge.

Responsibilities

• Work closely with physical design team, power integrity and package teams to model thermal performance of SoCs with a particular focus on on-die hotspots. This will apply to monolithic design as well as multichip solutions including 3DIC.
• Develop guidelines for optimization of SoC floorplanning and packaging technology to reduce the temperature variation across an SoC.
• Work with system-level thermal tools and partners to further develop strategies that reduce temperature excursions in Arm SoC designs.
• Identify, model and quantify the thermal benefits of various system approaches to help our team better understand the thermal constraints in systems. This would be in both steady-state and transient analyses.
  
  

Required Skills And Experience

• Bachelors, Masters, or Ph.D. degree in Electrical Engineering or Mechanical Engineering, with a strong computer architecture and thermal performance background
• Minimum 2-3 years of experience in performance modeling and analysis of SoC systems with emphasis on thermal performance. Work experience in mobile and/or laptop cooling is a plus.
• Proficiency in thermal analysis tools like Cadence Celsius, Ansys RedHawk-SCET or Ansys Icepak
• Excellent interpersonal skills, strong initiative and open in engaging and learning new concepts and sharing with collaborators.