Manufacturing Engineer - Bar Process

Summary

We are seeking a Manufacturing Engineer to support the cleaving, bar stacking/unstacking and dicing operations within our semiconductor manufacturing facility. This role is responsible for maintaining production flow by troubleshooting equipment and process issues, performing routine calibration and maintenance of equipment, monitoring product quality, and driving continuous process improvements to improve yield, quality, and throughput.

Primary Responsibilities

Production Support

• Troubleshoot production issues affecting cleaving, bar stacking/unstacking and dicing operations

• Resolve equipment and work order issues to minimize production downtime

• Support daily production activities to ensure smooth manufacturing flow

Equipment Ownership

• Perform daily calibration of cleaving and dicing equipment

• Monitor equipment performance and coordinate preventive maintenance

• Identify equipment-related problems and implement corrective actions

Process Improvement

• Perform root cause analysis on manufacturing issues

• Analyze production data to identify process improvements

• Improve yield, throughput, and process stability

• Implement corrective and preventive actions (CAPA)

• Develop process recipes for new products

Quality

• Monitor daily production quality for abnormalities

• Investigate defects related to cleaving and dicing processes

• Collaborate with Quality Engineering to resolve manufacturing issues

Documentation & Training

• Develop and maintain SOPs and work instructions

• Train manufacturing technicians and operators

• Maintain engineering documentation

Cross-functional Support

• Collaborate with Production, Quality, Process Engineering, Production Control, and IT to improve manufacturing efficiency

• Perform other duties as assigned

New Equipment Qualification

• Intensively collaborate with vendor for new tool design proposal

• Make FAT and SAT documents for new tools

• In charge of new tool move in, installation, modification and qualification

Qualifications

• Master’s degree in Materials Engineering, Mechanical Engineering, Manufacturing Engineering, Electrical Engineering, or related discipline

• Experience with semiconductor wafer processing, cleaving, dicing, or precision manufacturing

• Experience maintaining automated manufacturing equipment

• Knowledge of semiconductor manufacturing processes

• Strong troubleshooting and root cause analysis skills

• Experience using Excel for data analysis

• Familiarity with LabVIEW is a plus

• Ability to work in a cleanroom environment

• Strong ability in communication. Good at efficiently communicating with vendors on technical terms and negotiations

• Ability lift or move items weighing up to 20 pounds

Location

This position will be on-site based in Sugar Land, Texas.

WHY AOI?

• Flexible and competitive health (medical, dental, vision) plans offer the employee with the right options to meet individual needs

• Employer matching on 401(k) deferrals

• Unused PTO payout at end of the year

• Relocation package available within US

• Immigration sponsorships (Must be currently authorized to work in the US)

We do not accept unsolicited proposals from third-party recruiters or agencies. Contacting hiring managers directly may result in disqualification of submissions.