Technical Program & Quality Manager (System-in-Package)

Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job, and there's no telling what you could accomplish. The people here at Apple don’t just create products — they create the kind of wonder that’s revolutionized entire industries. It’s the diversity of those people and their ideas that inspires the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. Join Apple and help us leave the world better than we found it. Apple products are as alluring on the inside as they are on the outside. Inside every one of our products are some of the world's most challenging SiP designs. Imagine yourself as a select member of the team that brings these from concept to high-volume manufacturing. This pivotal and highly visible role within the DFM organization seeks a seasoned Technical Program Management (TPM) and Quality professional with experience in semiconductor packaging or electronic assembly processes. The role involves partnering with manufacturing suppliers (OSATs or CMs) and collaborating with internal cross-functional teams, including NPI Operations, Procurement, and Engineering, to optimize product design and process for manufacturability. The successful candidate will develop and implement robust factory and quality control systems to ensure high standards for incoming and outgoing product quality. They will deliver efficient, scalable manufacturing solutions that achieve high yields, low costs, and the ability to meet critical timelines. This role also serves as a key point of contact during factory or quality excursions, providing clear and timely communication to management, cross-functional teams, and suppliers. The candidate will proactively identify, address, and prevent critical issues while driving continuous improvement in factory operations and product quality. Minimum Qualifications: 12 Experience in semiconductor packaging or electronic assembly processes, including SMT, underfill/mold, laser, PVD/coating, bending, testing, and other related technologies. B.S or M.S in Mechanical Engineering, EE, Material Science or related Preferred Qualifications: Strong understanding of product quality and reliability, with a knowledge of industry standards and best practices. Proven problem-solving and debugging skills with a proactive approach to addressing complex technical challenges, leveraging expertise in FA techniques and commonality studies to identify root causes and implement effective corrective actions. Data-driven decision-making, with proficiency in tools such as JMP and Tableau for analysis and visualization. Experience collaborating with Asia-based manufacturing suppliers to ensure quality and maintain strong partnerships. Proven ability to work effectively within cross-functional teams, promoting collaboration among diverse individuals with varying levels of expertise. Exceptional interpersonal and communication skills, with the ability to clearly articulate technical concepts, create comprehensive documentation, and deliver impactful presentations. Strong program and project management skills, with the ability to prioritize tasks and deliver results in fast-paced environments.