Advanced Microfabrication Technology Engineer

Location: Yocumtown, Pennsylvania Department: Engineering Posted: 3/11/2026 Location Name: Valley Green

Wage: Depends on Experience

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets. Amphenol Corporation is one of the world’s largest designers and manufacturers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. ACS has an expansive global presence in research and development, manufacturing, and sales. We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment, and automotive.

Position: Advanced Microfabrication Technology Engineer

Location: Etters, PA

Amphenol High Speed Products Group is the market leader for high speed, high bandwidth electrical connectors for the Telecom/Datacom market (Mobile Networks, Storage, Servers, Routers, Switches, etc.). Our products help to enable the electronics revolution and remain a key enabler for all the major Tier 1 OEMs globally. We are currently seeking an experienced Advanced Microfabrication & Interconnect Technology Engineer to join our team.

Responsibilities

As an Advanced Microfabrication Technology Engineer reporting to the Sr. Engineering Manager, you are responsible for the development, evaluation, and implementation of micro-fabrication processes and micro-scale manufacturing methods for next generation interconnect technologies.

• Evaluate, develop, and optimize micro-fabrication processes to produce high precision interconnect/connector components (e.g., contacts, shields, spring elements, micro-housings, and alignment features).
• Lead lab and pilot-scale experiments to prototype and validate emerging microfabrication and micro-assembly technologies for next generation Telecom/Datacom products.
• Develop and qualify micro-assembly processes for very small parts, including fixturing, alignment strategies, and robust part handling methods; support semi-automation/automation concepts (vision alignment, pick-and-place, error-proofing).
• Assess and apply multiple microfabrication methods as appropriate, such as photolithography/patterned processing, precision etching, laser micromachining, micro-EDM, micro-stamping/forming, electroforming/plating-based fabrication, and micro-injection molding or insert molding.
• Define process windows and characterization plans (DOE, process maps, capability studies, measurement system inputs) to ensure repeatable, scalable manufacturing outcomes.
• Support metrology and characterization (optical/digital microscopy, profilometry, cross-sectioning, SEM as needed) and correlate feature quality to performance and reliability.
• Perform root cause analysis and implement corrective actions for yield, dimensional, assembly, and reliability issues involving micro-scale components and processes.
• Collaborate with Development, NPI, Signal and Mechanical Integrity teams to translate design needs, customer requirements, and cost-reduction opportunities into manufacturable micro-scale solutions.
• Interface with suppliers, tool shops, equipment vendors, research labs, and universities to assess emerging microfabrication technologies; support qualification, technology transfer, and scale-up to manufacturing teams.
• Document technical findings, prepare reports, and communicate recommendations to stakeholders in a detailed manner.
  
  

Qualifications

• Bachelor’s degree in Mechanical Engineering, Materials Science, Manufacturing Engineering, Electrical Engineering, Chemical Engineering, Physics, or related discipline (Master’s or PhD preferred).
• 5 years of experience in microfabrication and/or micro-scale manufacturing/assembly (connector/interconnect, communications electronics, semiconductor packaging, micro-optics, medical devices, MEMS, or precision electromechanics preferred).
• Hands-on knowledge of multiple microfabrication methods (e.g., lithography/patterning, laser micromachining, micro-EDM, micro-stamping, electroforming/plating, micro-injection molding).
• Experience developing and qualifying processes for very small components, including tolerance management, fixturing, and part handling.
• Experience with joining and micro-assembly techniques such as laser welding, micro-soldering, adhesives, crimping/swaging, and precision mechanical assembly.
• Proficiency in data analysis tools (MS Excel, Minitab, MATLAB or equivalent) and statistical problem solving (DOE, capability, MSA).
• Familiarity with metrology and characterization techniques (optical microscopy, profilometry, cross-sectioning/SEM, mechanical testing) and ability to link micro-scale variation to performance.
• Experience interfacing with suppliers and equipment vendors; ability to translate R&D learning into scalable production processes.
• Experience with solid modeling tools - Creo and/or SolidWorks and/or NX; ability to collaborate with tooling and automation teams.
• Collaborative mindset and excellent communication skills with a desire and ability to make hands-on positive impact.
  
  

Amphenol Corporation is proud of our reputation as an excellent employer. Our focus is to provide the highest level of support and responsiveness to both our employees and our customers, the world's largest technology companies. Amphenol Corporation offers the opportunity for career growth within a global organization. We believe that Amphenol Corporation is unique in that every employee, regardless of his or her position, has the ability to positively impact the business.

Amphenol is an “Equal Opportunity Employer” - Minority/Female/Disabled/Veteran/Sexual Orientation/Gender Identity/National Origin. For additional company information please visit our website at https://www.amphenol-cs.com/