What are the responsibilities and job description for the Software Dev Manager, Antenna Calibration, Amazon Leo position at Amazon Kuiper Manufacturing Enterprises LLC?
DESCRIPTION
Amazon LEO is an initiative to increase global broadband access through a constellation of 3,236 satellites in low Earth orbit (LEO). Its mission is to bring fast, affordable broadband to unserved and underserved communities around the world. Amazon Leo will help close the digital divide by delivering fast, affordable broadband to a wide range of customers, including consumers, businesses, government agencies, and other organizations operating in places without reliable connectivity.
The Antenna Calibration team is responsible for the calibration of all of the phased array antennas for Amazon Leo. This includes influence into custom ASIC design, bring-up of hardware, validation of system performance, antenna beampattern measurement, simulation, high-volume manufacturing, as well as the design and development of multiple software applications to carry out our areas of ownership.
As a software manager for antenna systems, you will collaborate with systems architects, hardware engineering design teams & FW/SW design teams to build and test systems containing FPGAs, 1P/3P custom ASICs, and RF Hardware. Responsibilities include:
Export Control Requirement:
Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
The Antenna Calibration team is responsible for the calibration of all of the phased array antennas for Amazon Leo. This includes influence into custom ASIC design, bring-up of hardware, validation of system performance, antenna beampattern measurement, simulation, high-volume manufacturing, as well as the design and development of multiple software applications to carry out our areas of ownership.
As a software manager for antenna systems, you will collaborate with systems architects, hardware engineering design teams & FW/SW design teams to build and test systems containing FPGAs, 1P/3P custom ASICs, and RF Hardware. Responsibilities include:
- Software design for high-volumn phased array manufacturing
- Calibration software for on-orbit applications
- Characterizing subsystems and systems related to antennas
- Complex data storage
- Hardware test automation
- Firmware design and implementation
- Application development
- Design automation for 2D and 3D structures
- Develop bring up tools and scripts for phased array systems
Export Control Requirement:
Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
BASIC QUALIFICATIONS
- 3 years of engineering team management experience
- 7 years of working directly within engineering teams experience
- 3 years of designing or architecting (design patterns, reliability and scaling) of new and existing systems experience
- 8 years of leading the definition and development of multi tier web services experience
- Knowledge of engineering practices and patterns for the full software/hardware/networks development life cycle, including coding standards, code reviews, source control management, build processes, testing, certification, and livesite operations
- Experience partnering with product or program management teams
- Bachelor's degree or foreign equivalent in Computer Science, Engineering, Mathematics, or a related field
PREFERRED QUALIFICATIONS
- Experience in communicating with users, other technical teams, and senior leadership to collect requirements, describe software product features, technical designs, and product strategy
- Experience in recruiting, hiring, mentoring/coaching and managing teams of Software Engineers to improve their skills, and make them more effective, product software engineers
- Experience leading an embedded software team, working with FPGAs, custom ASICs, and high speed chip to chip communication.
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
Our compensation reflects the cost of labor across several US geographic markets. The base pay for this position ranges from $166,400/year in our lowest geographic market up to $287,700/year in our highest geographic market. Pay is based on a number of factors including market location and may vary depending on job-related knowledge, skills, and experience. Amazon is a total compensation company. Dependent on the position offered, equity, sign-on payments, and other forms of compensation may be provided as part of a total compensation package, in addition to a full range of medical, financial, and/or other benefits. For more information, please visit https://www.aboutamazon.com/workplace/employee-benefits. This position will remain posted until filled. Applicants should apply via our internal or external career site.
Salary : $166,400 - $287,700