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Senior Microelectronics Packaging Engineer

Allegro MicroSystems
Manchester, NH Full Time
POSTED ON 12/5/2025 CLOSED ON 1/4/2026

What are the responsibilities and job description for the Senior Microelectronics Packaging Engineer position at Allegro MicroSystems?

The Allegro team is united by a clear purpose—advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business—from breakthrough product development and customer success to how we show up for each other and the communities we serve.

The Opportunity

Develop robust and reliable packaging solutions for Allegro's cutting-edge sensor, power, and high-voltage power integrated circuits. Collaborate with cross-functional teams, including design, quality, reliability, and manufacturing, to ensure that package designs meet stringent performance, quality, and cost targets. Responsible for all aspects of package development, from initial concept and design through qualification, failure analysis, and high-volume production release.

What You Will Do

  • Design and develop integrated circuit packages, process flows, and materials supporting Sensor, Power, and High Voltage Power product development.
  • Create AutoCAD drawings, 3D models, and detailed specifications for integrated circuit packages.
  • Employ DFMEA and other Advanced Product Quality Process (APQP) methodologies to ensure designs meet project mission profiles and Allegro’s quality and reliability objectives.
  • Collaborate with the Allegro quality and reliability team to design appropriate qualification and failure analysis plans for new packages.
  • Analyze qualification data and support the transition of new packages into high-volume production.
  • Manage project schedules and deliverables and maintain design documents and reports in SharePoint.
  • Collaborate with cross-functional teams on new package development and optimization of existing high-volume production packages.
  • Work closely with internal and external package assembly sites to verify in-process data and oversee pre-production manufacturing execution.
  • Perform modeling and simulation using ANSYS and LS-DYNA for various semiconductor packages and processes.
  • Conduct mechanical and thermal material characterizations using an Instron mechanical tester and Siemens T3ster.
  • Create detailed technical reports and presentations for both technical and non-technical audiences.


Hybrid office/home work schedule.

Requirements

  • Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Industrial and Systems Engineering and 5 years of experience with:
    • working with package design for magnetic sensing and power IC applications; and
    • Using AutoCAD and SolidWorks, as well as ANSYS and LS-DYNA simulation platforms.
  • Alternatively, will accept a Master’s degree in the same fields and 3 years of same experience.
  • As another alternative, will accept a Ph.D. in the same fields with specific coursework involving Materials Science and Engineering Fundamentals, including:
    • Material Structure Analysis
    • Metal Physics
    • Solid State Physics
    • Thermodynamics of Materials
    • Fundamentals of Crystallography
Why Allegro?

Join Allegro and become part of a team where your contributions truly matter.

We foster a culture of Real Innovation, empowering you to push boundaries, develop cutting-edge solutions, and drive continuous improvement.

Your work will create a Real Impact by solving complex real-world challenges that fuel our success and shape the future of technology.

You’ll experience Real Connection, collaborating with talented colleagues around the globe in an environment built on trust, respect, and a shared purpose.

Join Us—and Help Build What’s Next.

At Allegro, we are committed to providing a harassment-free environment of mutual respect to fuel innovation through inclusive thought collaboration. Allegro is an Equal Opportunity Employer and does not discriminate on the basis of race, religion, color, sex, gender identity, sexual orientation, age, physical or mental disability, national origin, veteran status, parental status, or any other basis covered by appropriate law. Allegro makes hiring decisions based solely on qualifications, merit, and business needs at the time.

Eligible applicants must reside in a state where Allegro currently has an office location: This includes New Hampshire, Massachusetts, Texas, and Michigan. Certain positions (such as field sales roles) may be exempt from this requirement.
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Salary.com Estimation for Senior Microelectronics Packaging Engineer in Manchester, NH
$114,916 to $140,179
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