What are the responsibilities and job description for the Lead Application Engineer position at Advantest America?
We are seeking a highly experienced Lead Application Engineer to join Advantest's Research & Ventures (R&V) team, developing and delivering advanced semiconductor test solutions on the Advantest V93000 Test Platform, with a strong focus on wafer-level (die-level) testing, thermal management, and high-performance digital devices.
As part of the R&V team, you will have the opportunity to work on new and cutting-edge technologies and play a critical role in incubating, enabling, and bringing new products and capabilities to our customers. You will be a key technical contributor, working closely with R&D, cross-functional teams and customers to transform early concepts and advanced technologies into robust, scalable test solutions.
You will independently design, implement, debug, and optimize test programs for silicon devices at the wafer level, while managing the thermal and electrical challenges.
The ideal candidate is a self-starter with strong SmarTest8 expertise, hands-on experience with die-level probers, and a passion for innovation-capable of leading technical discussions, influencing research, and delivering end-to-end solutions that shape the future of semiconductor testing.
Responsibilities
- Lead the design, development, execution, and debugging of test programs on the Advantest V93000 platform
- Develop test programs, test methods, and reusable libraries using C and Java in SmarTest8
- Own wafer-level (die-level) test program development, including silicon bring-up, characterization, and support using die-level probers
- Manage and optimize thermal aspects of device testing, including temperature control strategies, thermal limitations, and correlation of electrical behavior across temperatures
- Work with high-power devices and develop test programs that actively manage power dissipation and thermal constraints during testing, ensuring safe operation, test integrity, and repeatable results across operating conditions
- Execute, debug, and resolve test program issues on both, offline and online systems
- Provide end-to-end ownership of test solutions, spanning ATE hardware, probers, load boards, probe cards, and test software
- Debug and resolve complex issues across hardware, software, silicon, and thermal domains
- Act as the primary technical interface for cross-functional teams, leading technical discussions, design reviews, and root-cause analysis sessions
- Support requirements analysis, benchmark testing, demonstrations, and training
- Collaborate closely with R&D, COE, and global engineering teams to develop next-generation wafer-level and system-level test solutions
- Partner with leading customers on nextgeneration highpower devices to codefine advanced test requirements, exploring power delivery, thermal management, and waferlevel test methodologies on the V93000 platform
- Lead customerfacing engagements-including technical discussions, deepdives, and pilot programs-to prototype and validate highpower, thermallyconstrained test solutions, transforming early concepts into scalable test programs, methods, and reusable frameworks.