What are the responsibilities and job description for the PC Board Design Engineer position at Advanced Micro Devices, Inc?
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THE ROLE:
AMD is seeking a skilled PCB Design Engineer with expertise in high-performance, multi-layer board design. This role will lead PCB architecture and layout for cutting-edge platforms, directly impacting system performance, manufacturability, and power delivery. The ideal candidate will bring advanced knowledge of Cadence Allegro or equivalent tools, high-speed interfaces, and complex BGA architecture trade-offs.
THE PERSON:
You are a highly skilled PCB design engineer who thrives in fast-paced, collaborative environments. You have strong technical expertise in high-speed board design and SI/PI, with the ability to optimize system-level performance and guide critical design trade-offs. You excel at cross-functional collaboration and mentoring, and are motivated to deliver high-quality, manufacturable designs.
KEY RESPONSIBILITIES:
Lead PCB layout and architecture for high-speed systems, including DDR5, PCIe Gen5/Gen6, USB4, and 100G Ethernet.
Evaluate BGA fan-out strategies, layer stackups, and interface placement for signal integrity and power delivery.
Collaborate with electrical, mechanical, and SI/PI teams to optimize performance and manufacturability.
Design complex multi-layer boards (12 layers) incorporating HDI techniques, blind/buried vias, and controlled impedance routing.
Perform SI/PI simulations and guide layout decisions based on analysis results.
Generate fabrication and assembly documentation (Gerbers, ODB , BOMs, fabrication notes).
Interface with vendors to ensure DFM/DFT compliance and cost-effective production.
Mentor junior engineers and contribute to process and methodology improvements.
PREFERRED EXPERIENCE:
Proficiency in Cadence Allegro or similar EDA tools.
Strong knowledge of BGA layout constraints, power delivery networks, and interface optimization.
Experience with DDR5, PCIe Gen5/Gen6, USB4, and other high-speed protocols.
Familiarity with SI/PI simulation tools such as Sigrity or HyperLynx.
IPC CID or CID certification strongly preferred.
Experience with thermal modeling and mechanical integration.
Hands-on lab experience with board bring-up and debug.
Knowledge of regulatory compliance standards (EMC, FCC, CE).
ACADEMIC CREDENTIALS:
Bachelor’s or Master’s degree in Electrical Engineering or related technical field (minimum Bachelor’s required).
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