Electronics Packaging Power Delivery Technology Lead

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The Role:

We are seeking a candidate to drive power delivery technology and design tool development for 2.5D/3D IC packaging technologies targeted for future AI products. Products in this segment will have significant generation-over-generation growth in power handling requirements and design complexity while holding to aggressive schedules, so new EDA tools are required to accelerate the speed, accuracy, and performance of advanced packaging design. In this role, the candidate will work with AMD’s advanced packaging technology teams to understand the capabilities required for next generation AI products, then translate these into needs for new development with AMD’s EDA tool vendors, manage the implementation of tool improvements, and finally propagate these capabilities to AMD’s physical design and SI/PI teams. A particular emphasis will be placed on incorporating new AI capabilities to increase the velocity of physical design and SI/PI engineers. The candidate will be expected to operate these tools in support of ongoing packaging programs.

The Person:

AI applications require the most sophisticated and complex electronics packaging solutions ever built – an enthusiasm to work in this challenging, fast-paced space is a must. In addition to having a solid working knowledge of advanced packaging technologies, a successful candidate will have direct experience and with electronics packaging EDA tools for physical design and electrical simulation and an interest in expanding the capabilities and accuracy of these tools. Interest and experience in using AI tools to accelerate EDA is also valued. While the role is technical, the position will require stakeholder management for several projects run in parallel across multiple internal and external teams, so an aptitude for and enjoyment of program management skills will be an asset. Candidates will be expected to regularly update internal and external executives so strong presentation skills will be an asset.

Key Responsibilities:

• Drive AMD’s CAD and EDA tool vendors to automate and simplify advanced package (‘3DIC’) power integrity design and analysis flows including EM/IR.
• Execute these flows as required in support of next generation advanced packaging projects.
• Enable packaging physical design engineers to independently execute a subset of these flows in order to reduce design cycles and improve the quality of early design releases.
• Enable automation and AI assistance to improve efficiency and reduce resource requirements for future product designs.
• Partner with packaging technology teams to identify and develop next-generation power delivery solutions.

Minimum Qualifications:

• B.S. degree in electrical engineering, computer engineering, or a related discipline plus five years of industry experience.
• Direct experience with packaging EDA tools.
• Direct experience with coding and automation.

Preferred Qualifications:

• Experience with coding in Python and TCL, particularly for the automation of CAD and EDA tools.
• Experience using AI agents to accelerate code development and EDA tool useage.
• Hands-on experience with at least one industry standard packaging physical design CAD tool.
• Hands-on experience with at least one industry standard tool for power integrity analysis.

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AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.