Director, Advanced Packaging Technology Development and Execution

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We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

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The Role:

We are looking for a dynamic and experienced Senior advanced Packaging Leader to own the strategy, roadmap, and execution of advanced packaging solutions across AMD’s product lines. This individual will lead cross-functional packaging programs from early concept to high-volume manufacturing, ensuring that AMD’s leadership in performance, power, and form factor is continuously extended through cutting-edge packaging innovation. This role requires a visionary technical leader with strong execution capability- someone who understands the complex interaction between product architecture, package design, 2.5D/3D advanced packaging capabilities at OSATs and foundries, substrate technology, and manufacturing scalability. The ideal candidate brings a blend of strategic roadmap planning, hands-on execution oversight, and supplier collaboration.

Key Responsibilities:

• Define and drive AMD’s advanced packaging technology roadmap for key products with supply chain partners, aligned with long-term product and architectural goals
• Lead cross-functional packaging development programs, working with product engineering, silicon design, platform teams, and manufacturing operations
• Translate system-level requirements into packaging specifications and ensure alignment across substrate design, materials, thermal/mechanical performance, and electrical targets
• Evaluate and select advanced packaging technologies (e.g., 2.5D, 3D-IC, chiplet integration, hybrid bonding) based on technical feasibility and cost/performance trade-offs
• Partner closely with foundries and OSATs, substrate vendors, and foundries to ensure technical readiness and scalable manufacturing for product ramp
• Drive yield, reliability, cost, and manufacturability considerations early in the packaging development lifecycle
• Monitor execution milestones and escalate technical and programmatic risks with clear mitigation plans
• Serve as a technical interface to executive stakeholders on packaging strategies, decisions, and execution status

The Person:

You are a strategic technical leader who thrives in fast-paced environments and is passionate about enabling next-generation compute platforms through advanced packaging. You are comfortable working across engineering, operations, and executive teams, and you bring deep expertise in advanced packaging materials, structures, and supply chain ecosystems.

Preferred Experience:

• 15 years of experience in semiconductor packaging development, with a strong focus on high-performance products (e.g., CPUs, GPUs, APUs, SoCs)
• Proven leadership in defining and executing packaging roadmaps across client or server segments
• In-depth knowledge of advanced packaging technologies, including 2.5D, 3D stacking, chiplet integration, fan-out, embedded bridges, and hybrid bonding
• Hands-on experience managing development and ramp with OSATs, substrate suppliers, and foundry partners
• Familiarity with package design tools, electrical and thermal simulation, and reliability qualification requirements
• Strong communication and leadership skills to engage with technical and executive stakeholders across functions

Academic Credentials:

• BS/MS/PhD in Materials Science, Mechanical Engineering, Electrical Engineering, or related discipline

Location: Austin, TX

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Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.