What are the responsibilities and job description for the Advanced Packaging Engineer position at Accroid Inc?
Top Mandatory Skills:
- 7 years of advanced semiconductor packaging experience.
- Hands-on experience with 2.5D & 3D packaging technologies.
- Strong experience with chiplet architectures and heterogeneous integration.
- Experience with multi-die package design, silicon interposers, TSV, and advanced substrate technologies.
- Experience supporting AI/HPC semiconductor products from concept through production.
- Strong knowledge of package assembly, manufacturing, reliability, yield improvement, and qualification.
- Experience working with OSATs and semiconductor foundries.
- Solid understanding of thermal, mechanical, and electrical aspects of package design.
- Bachelor''''''''''''''''''''''''''''''''s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related field.
Preferred Skills:
- Experience with CoWoS, Foveros, EMIB, SoIC, or similar advanced packaging technologies.
- HBM integration experience.
- Experience with Cadence Allegro or Siemens Xpedition Package Designer.
- Experience supporting AI Accelerators, GPU, CPU, or ASIC products.
- Knowledge of SI/PI analysis, JEDEC standards, and package failure analysis.