Failure Analysis Engineer

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Broadcom is seeking an experienced and driven Failure Analysis Engineer. In this role, you will be the technical lead who ensures the successful diagnosis and characterization of complex failures in advanced silicon (e.g., FinFET, GAA) and advanced packaging technologies (e.g., CoWoS-S/L, 3DIC, CPO) critical to Broadcom’s most sophisticated products, including our industry-leading AI accelerators and high-speed networking solutions. You will leverage your deep expertise across all facets of FA (i.e., fault isolation, EFA, PFA) to pioneer new workflows tailored for the rapidly evolving landscape of next-generation silicon and packaging technologies. This role is built for a hands-on, strategic problem-solver seeking an opportunity to grow as a technical leader, collaborate with global cross-functional teams, and ensure the highest quality in bleeding edge technologies. Responsibilities: Hands on technical expert capable of in depth fault analysis across a wide range of silicon and package technology. Plan and execute individual FA plans through background data collection, ATE datalog interpretation, non-destructive analysis (optical, CSAM, X-Ray, TDR, IV curve trace) Fault localization (ATE, application board, PEM, DLS, OBIRCh, thermal, scan, memory) Physical Analysis (mechanical, chemical, PFIB), nanoprobing, and analytical techniques (FIB, SEM, EDX) to isolate and characterize defects. Collaborate with global cross-functional teams (design, process, test, reliability) to identify root causes of failures from various stages of the product lifecycle (e.g., design, reliability, RMA). Clear communication of complex FA findings, both written and verbal, to enable data-driven corrective action of critical quality issues. Develop and implement new failure analysis methodologies and procedures unique to advanced silicon & packaging technologies to enhance efficiency and effectiveness. Evaluate & stay updated on the latest advancements in failure analysis techniques and semiconductor technology. Team-based culture through open communication, continuous improvement, and willingness to assist others. Qualifications: Bachelor's and 8 years of relevant experience, or Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field and 6 years of relevant experience. Strong understanding of semiconductor device physics, fabrication processes, and packaging technologies. Proficiency in various failure analysis techniques and equipment (e.g., scan diagnostics, PEM, DLS, nanoprobing, SEM, EDS, FIB). Excellent problem-solving skills and a methodical approach to root cause analysis. Ability to work independently and as part of a team in a fast-paced environment. Broad interests, self-driven, lifelong learner, and a good team member. Expert project management skills, capable of managing multiple root cause projects in conjunction with lab support. Highly Desired Qualifications: Experience with <5nm finFET or GAAFET technologies Experience with 3DICs, CoWoS-L, co-packaged optics (CPO), or co-packaged copper (CPC) Expertise in design-based FA (scan and memory diagnostics) Expertise in beam-based FA techniques (e.g., nanoprobing, PFIB delayering / cross-section) ATE test flow generation, pattern modification, and hardware In-depth knowledge of advanced package construction and failure analysis Additional Job Description: Compensation and Benefits The annual base salary range for this position is $108,000 - $172,800 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence. Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. For more information please visit our video library and check out our Connected by Broadcom series. Follow us on Linked In Broadcom Inc.

Salary : $108,000 - $172,800